Description:
This Quicktime animation shows how the machining process of "lapping" removes controlled amounts of silicon from a wafer in order to ensure flatness of the silicon wafer. This process removes particles and improves the quality of the wafer after they are cut. This animation is the fifth in a series of how silicon wafers are created.
<br>
<br>The previous animation showing <a href="http://www.memc.com/mov-edgeprofiling.html">silicon ingot edge profiling can be seen here</a>.
<br>
<br>The next animation in this sequence about <a href="http://www.memc.com/mov-polishing.html">silicon wafer polishing can be seen here</a>.
