The U.S. National Science Foundation (NSF) has unveiled a $45.6 million investment across 24 research and education initiatives, aided by the "CHIPS and Science Act of 2022," aimed at advancing semiconductor technologies, manufacturing, and workforce development. These projects are part of the NSF Future of Semiconductors (FuSe) program, conducted in collaboration with companies such as Ericsson, IBM, Intel, and Samsung. The program's primary objectives are to foster the growth of a skilled semiconductor workforce and to drive innovations in semiconductor technologies and systems, addressing the nation's need for a secure and reliable supply of semiconductor technologies.
The FuSe program supports three key research areas: domain-specific computing, advanced function and high performance by heterogeneous integration, and new materials for energy-efficient and sustainable semiconductor systems. In addition to NSF funding, this initiative is supported by annual contributions from industry leaders, including Ericsson, IBM, Intel, and Samsung. This public-private partnership aims to guide research priorities, accelerate technology development, and prepare the future workforce while addressing the rising demand for semiconductors in the United States. This effort builds upon previous NSF investments in semiconductor workforce development and underscores the critical role of collaboration between academia and industry in shaping the future of semiconductor technology and manufacturing. Read the full news brief on the NSF website.