This talk will present how MEMS CAD tools coupled with standard analog and digital design tools may be used for the co-simulation and modeling of MEMS devices, their associated electronics and packaging in commercial MEMS systems. Examples will be given of important co-design issues such as how to simulate packaging effects on MEMS device performance, how to co-simulate electronics and MEMS to calculate system timing, and how to model and evaluate the thermal, mechanical and electrical performance of new packaging concepts such as system in package. The talk will also discuss design tools and strategies for those system designers wishing to utilize third party or off the shelf MEMS sub-systems.
To register for this event please click here.
To register for this event please click here.
- Webinar
- Micro and Nanotechnologies
