The atomic force microscope (AFM) is a versatile characterization tool that allows users to acquire high-resolution images of nanoscale surface features. In addition to probing nanoscale surface topography, AFMs can be used to print nanoscale structures using additive and subtractive lithographic techniques. Specialized AFM imaging modes are often required to view nanostructures fabricated using AFM lithography. This talk will provide an overview of AFM lithographic techniques including dip pen nanolithography (DPN), nanoshaving, and electrochemical techniques. This talk will also include a description of specialized AFM imaging modes used to characterize nanostructures printed with AFM. The specialized AFM modes in this talk will include lateral force microscopy (LFM) and phase imaging. A remote-access demonstration of AFM lithography and phase imaging will follow.

AFM lithography demonstration using contact probe to etch area of polyvinylpyrrolidone (PVP) from the glass substrate. After the initial area has been etched, a tapping probe will be used to image an expanded area in-phase mode, which will show differences in surface stiffness/softness between the PVP and the glass substrate.

Sputtering is a fundamental Physical Vapor Deposition method that utilizes plasma. This session will focus on igniting a plasma for the benefit of thin film deposition. Both DC and RF plasma-based sputtering methods will be discussed. The physics of plasma will be elucidated by emphasizing the importance of different power supply and pressure settings using simulations. Ion bombardment and sputtering of atoms from the target materials will be interactively analyzed with the aid of simulations, as well. The resulting superiority of sputtering over evaporation will be discussed. Finally, a nucleation example will be covered by sputtering gold on a glass sample. The optical properties of the sputtered material will be studied in order to understand how gold atoms are sputter-coated on a substrate such as glass.

Educators at all levels desire for their students to succeed. For Community College educators teaching technical education course success is often defined as “graduates getting jobs”. Achievement of this goal is often tied to having a direct correlation between the student outcomes from the courses in the program and the industry requirements for new hires at a technician level. Industry participation in CC technical education programs is critical to ensure this correlation and also provide students with insight into the career environment and the myriad of opportunities available. This workshop will focus on a three-step process that educators can follow to prepare them to 1) successfully execute the initial contact with industry 2) be prepared for a “face to face” meeting with an industry person and 3) invite the participation of the industry/company as a supporting participant in the technician program. During the workshop, the participants will walk through the process for their particular technical education program and industry segment. Workshop results will be a checklist of items to complete and various suggestions as well as the first draft of the content that will go on a “blank sheet of paper”.

The field of micromechanics is now a well-established engineering domain with a demonstrated impact on science, technology, and product development. At the core of this technology are movable mechanical structures, MEMS, with dimensions ranging from a few to 100’s microns, and rigid components that rely on external links for power supply and control. Removing these constraints would enable a new technology platform for responsive systems that can change shapes, deploy, gather energy from the local environment, and self-propel. These shape morphing systems create a new paradigm in engineering where the distinction between materials and mechanisms gets vague.

This presentation will introduce the fundamentals and limitations of current micro-machines and discuss the prospect of creating shape morphing structures by using origami and Kirigami techniques combined with nanoscale materials.

The foundations of Chemical Vapor Deposition (CVD) will be reviewed, with a focus on Low Pressure CVD (LPCVD), typical deposition system design, and the two modes of deposition. These modes will examine thin films, known as 2-dimensional nanoscale materials, and nanowires, known as 1-dimensional nanoscale materials. A lab tour with a look at a working CVD system may be included.

Oxidation is a way to create a non-conducting layer on Si wafers. Engineers carefully create isolation sites in order to channel the electrons for conduction. Having the ultimate goal of creating a transistor gate oxide in mind, the session will start by discussing various uses of the oxides and introduce wet and dry oxidation methods. The oxidation physics and chemistry will be highlighted heuristically and simulation methods will be offered to estimate the finalized oxide thicknesses. In contrast, ion implantation enables the engineers to assign certain areas to be more conductive. Next, the ion implantation tool will be introduced. The ion implantation mechanism will be studied by using a simulator for different dopant scenarios with different energies. Finally, atomic layer deposition as an emerging deposition method to achieve ultimate control over the thickness and quality will be covered. Atomic layer deposition of an alumina layer will be studied in-depth and the final thickness will be found out using an ellipsometer.