Chemical Mechanical Planarization Simulation

This simulation, provided by Maricopa Advanced Technology Education Center (MATEC), uses controls (drop down menus) to adjust down force and platen speed parameters to determine an optimum CMP process recipe for focal semiconductor manufacturing. Users may assume that focal is using a rotational tool with on-the-pad slurry delivery, and wafer/polish pressure is through the carrier. Users will keep track of "test runs" in separate tables, one for down force and one for platen speed, and then observe the effect of the parameters on wafer thickness and uniformity. Next, users can try to make predictions about the necessary settings for achieving a prescribed WIWNU goal. The objectives of this simulation include:

• solving for removal rate in a simulated CMP process
• adjusting planarization equipment process parameters to determine the optimal values needed to achieve the processing objectives in a simulated CMP process
• estimating control parameter settings in a CMP recipe simulation for optimal WIWNU and removal rate. 

An .mp4 recording is included that provides an example of the simulation. The recording runs 01:51 minutes in length.