This module, from Support Center for Microsystems Education (SCME), introduces students to common etch processes used in the fabrication of microsystems. Etch terminology, purpose, and processes are covered in the module. The included activities "allow students to demonstrate their understanding of the terminology and basic concepts of these processes."
This module includes six instructor guides, five participant guides, and a PowerPoint presentation. All documents include versions in PDF and Word. The included guides are Knowledge Probe (Pre-test), Primary Knowledge, Final Assessment, Bulk Micromachining: An Etch Process Activity, Etch Terminology Activity, and Science of Thin Films Activity. Instructor guides include additional content such as instructor notes and questions and answers. A Learning Module Map (LM) Instructor Guide is also included.
The LM map provides information about the module including module contents, target audience, and a map that is divided into the following three sections: Important Steps, Key Points, and Reasons.
The Knowledge Probe (Pre-test) helps determine a student's current knowledge of terminology and processes. Twenty questions are included.
Primary Knowledge is an introductory unit for this learning module and is a general overview of different etch processes used in the construction of microsystems. The following sections are included: Description and Estimated Time to Complete, Introduction, Key Terms, The Etch Process for Microsystems, Surface Etch, Transistor Etching, Bulk and Release Etch, Natural Bridges, and more.
This module includes three activities. The Bulk Machining Activity "demonstrates the bulk etch process used to selectively remove substrate material." This activity requires the SCME Bulk Machining: An Etch Process Kit that is available for purchase on the SCME website.
The Etch Terminology Activity includes a crossword puzzle and post-activity questions that test students' knowledge of etch for microsystems terminology.
The Science of Thin Films Activity helps students "better understand the basics of oxidation and etch rate as they apply to the isotropic wet etch of silicon dioxide (SiO2)." This activity requires the rainbow wafer that is provided in the SCME Science of Thin Film Kit that is available on the SCME website.
The Final Assessment is intended to determine a student's "understanding of the etch processes used in the fabrication of microsystems after having completed the learning module." Twenty questions are included.
This module also includes a PowerPoint presentation. The presentation includes a unit overview, objectives, an introduction, a summary, and covers the following topics: surface etch, transistor etching, bulk etch, release etch, natural bridges, etched layers, etchants, factors affecting etch quality, and more. A PDF version of the presentation is also included.
For orientation purposes the 'Fab_Etch_LM_MAP_IG' PDF is included as a separate attachment and offers a sample of the type of material included in this module.
Below is a list of the files included in the .zip attachment. The size of each file is included in parenthesis.
Etch Overview for Microsystems (36 files, 81.9 MB)
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